View MPXV4006_5028691.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Pressure
Freescale Semiconductor
+
MPXV4006 Rev 3, 1/2009
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXV4006 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for the appliance, consumer, health care and industrial market. The analog output can be read directly into the A/D input of Freescale microcontrollers. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. The axial port has been modified to accommodate industrial grade tubing.
MPXV4006 Series
Integrated Pressure Sensor
0 to 6 kPa (0 to 0.87 psi) 0.2 to 4.8 V Output
Application Examples
* * * * Washing Machine Water Level Measurement (Reference AN1950) Ideally Suited for Microprocessor or Microcontroller-Based Systems Appliance Liquid Level and Pressure Measurement Respiratory Equipment
Features
* * * * * 2.5% Maximum Error over +10C to +60C with Auto Zero 5% Maximum Error over +10C to +60C without Auto Zero Durable Thermoplastic (PPS) Package Available in Surface Mount (SMT) or Through-Hole (DIP) Configurations Available with Standard Fluorosilicone Gel or Media Resistant Gel
ORDERING INFORMATION
Option Surface ThroughNone Single Dual Gauge Differential Absolute Mount Hole Small Outline Package (Media Resistant Gel) (MPVZ4006 Series) MPVZ4006GW6U Rail 1735 * * * MPVZ4006GW7U Rail 1560 * * * Device Name Package Options Case No. MPVZ4006G6U MPVZ4006G6T1 Rail 482 Tape and 482 Reel MPVZ4006G7U Rail 482B Small Outline Package (MPXV4006 Series) MPXV4006GC6U Rail 482A MPXV4006GC6T1 Tape and 482A Reel MPXV4006GC7U Rail 482C MPXV4006GP Tray 1369 MPXV4006DP Tray 1351 # of Ports Pressure Type Device Marking MZ4006GW MZ4006GW MPVZ4006G MPVZ4006G
* * * * * * * * * * * *
* * *
* * * * * *
MPVZ4006G MPXV4006G MPXV4006G MPXV4006G MPXV4006GP MPXV4006DP
*
* *
(c) Freescale Semiconductor, Inc., 2006-2009. All rights reserved.
Pressure
SMALL OUTLINE PACKAGE SURFACE MOUNT
MPVZ4006GW6U CASE 1735-01
MPVZ4006G6U/T1 CASE 482-01
MPXV4006GC6U/C6T1 CASE 482A-01
MPXV4006DP CASE 1351-01
MPXV4006GP CASE 1369-01
SMALL OUTLINE PACKAGE THROUGH-HOLE
J
MPVZ4006GW7U CASE 1560-02
MPVZ4006G7U CASE 482B-03
MPXV4006GC7U CASE 482C-03
MPXV4006 2 Sensors Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Pressure Range Supply Voltage(1) Supply Current Full Scale Offset
(3)(5)
Symbol POP VS IS VFSS Voff V/P (10 to 60C) -- --
Min 0 4.75 -- -- 0.152 -- -- --
Typ -- 5.0 -- 4.6 0.265 766 7.511 -- --
Max 6.0 612 5.25 10 -- 0.378 -- 2.46 5.0
Unit kPa mm H2O Vdc mAdc V V mV/kPa mV/mm H2O %VFSS with auto zero %VFSS without auto zero
Span(2)
Sensitivity Accuracy(4)(5)
1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: Offset Stability: TcSpan: TcOffset: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure, at 25C. Output deviation, after 1000 temperature cycles, -30 to 100C, and 1.5 million pressure cycles, with minimum rated pressure applied. Output deviation over the temperature range of 10 to 60C, relative to 25C. Output deviation with minimum pressure applied, over the temperature range of 10 to 60C, relative to 25C.
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006, external mechanical stresses and mounting position can affect the zero pressure output reading. To obtain the 2.46% FSS accuracy, the device output must be "autozeroed'' after installation. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. The specified accuracy assumes a maximum temperature change of 5C between autozero and measurement.
MPXV4006 Sensors Freescale Semiconductor 3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Parametrics Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 24 -30 to +100 +10 to +60 Units kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
VS 2
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
4 Vout
3 GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXV4006 4 Sensors Freescale Semiconductor
Pressure
On-Chip Temperature Compensation and Calibration
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV4006/MPVZ4006 series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 and Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10C to 60C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
Fluorosilicone Gel Die Coat P1
Die
Stainless Steel Cap
+5 V OUTPUT
Wire Bond
Thermoplastic Case
Vout Vs IPS 1.0 F 0.01 F GND
Lead Frame
470 pF
P2 Differential Sensing Element Die Bond
Figure 2. Cross Sectional Diagram SOP (not to scale)
Figure 3. Recommended Power Supply Decoupling and Output Filtering Recommendations (For additional output filtering, please refer to Application Note AN1646.)
5.0 4.5 4.0 3.5 3.0 Output (V) 2.5 2.0 1.5 1.0 0.5 0 0
Transfer Function (kPa): Vout = VS*[(0.1533*P) + 0.053] 5.0% VFSS VS = 5.0 Vdc TEMP = 10 to 60C Output (V)
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0
Transfer Function (kPa): Vout = VS*[(0.1533*P) + 0.053] 2.46% VFSS VS = 5.0 Vdc TEMP = 10 to 60C
MAX
TYPICAL MIN
MAX MIN
TYPICAL
2.0
4.0
6.0
0
2.0
4.0
6.0
Differential Pressure (kPa)
Differential Pressure (kPa)
Figure 4. Output versus Pressure Differential at 5.0% VFSS (without auto zero, Note 5 in Operating Characteristics)
Figure 5. Output versus Pressure Differential at 2.46% VFSS (with auto zero, Note 5 in Operating Characteristics)
MPXV4006 Sensors Freescale Semiconductor 5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which isolates the die from the environment. The pressure sensor is Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table
Part Number MPVZ4006GW6U MPVZ4006GW7U MPVZ4006G6U/T1 MPVZ4006G7U MPXV4006GC6U/T1 MPXV4006GC7U MPXV4006GP MPXV4006DP Case Type 1735-01 1560-02 482-01 482B-03 482A 482C-03 1369-01 1351-01 Pressure (P1) Side Identifier Vertical Port Attached Vertical Port Attached Stainless Steel Cap Stainless Steel Cap Vertical Port Attached Vertical Port Attached Side with Port Attached Side with Part Marking
designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.660 16.76
0.100 TYP 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
Figure 6. SOP Footprint (Case 482)
MPXV4006 6 Sensors Freescale Semiconductor
Pressure
CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV4006 Sensors Freescale Semiconductor 7
Pressure
CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV4006 8 Sensors Freescale Semiconductor
Pressure
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPXV4006 Sensors Freescale Semiconductor 9
Pressure
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPXV4006 10 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
-A4 5
D 8 PL 0.25 (0.010)
M
TB
S
A
S
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41
S
N C H -TPIN 1 IDENTIFIER SEATING PLANE
J K M
DIM A B C D G H J K M N S
CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE
-A4 5
-BG
8 1
0.25 (0.010) S N
M
TB
D 8 PL S A
S
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.
DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.210 0.220 5.33 5.59 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0 15 0 15 0.405 0.415 10.29 10.54 0.540 0.560 13.72 14.22
DETAIL X
PIN 1 IDENTIFIER
C -TK M J DETAIL X
SEATING PLANE
CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE
MPXV4006 Sensors Freescale Semiconductor 11
Pressure
PACKAGE DIMENSIONS
-A-
4 5
D 8 PL 0.25 (0.010)
M
TB
S
A
S
N -B- G
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-T-
SEATING PLANE
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV4006 12 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE
MPXV4006 Sensors Freescale Semiconductor 13
Pressure
PACKAGE DIMENSIONS
CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE
MPXV4006 14 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE
MPXV4006 Sensors Freescale Semiconductor 15
Pressure
PACKAGE DIMENSIONS
CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV4006 16 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV4006 Sensors Freescale Semiconductor 17
Pressure
PACKAGE DIMENSIONS
CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV4006 18 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
-A-
4 5
N -B- G
8 1
0.25 (0.010)
M
TB
D 8 PL SA
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. S DIM A B C D G J K M N S V W SEATING PLANE INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17
DETAIL X S W
V C
PIN 1 IDENTIFIER
-T- K M J DETAIL X
CASE 482C-03 ISSUE A SMALL OUTLINE PACKAGE
MPXV4006 Sensors Freescale Semiconductor 19
Pressure
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.006 (0.15) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35)
D
L DETAIL G
A1
8
1
F
b 0.004 (0.1)
8X
M
CAB
B
E1
STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8.
GND +Vout Vs -Vout N/C N/C N/C N/C
STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8.
N/C Vs GND Vout N/C N/C N/C N/C
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
DIM A A1 b D E E1 e F K L M N P T INCHES MILLIMETERS MIN MAX MIN MAX 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0 7 0 7
N
T
A
M
P
8X
0.004 (0.1)
SEATING PLANE
K
DETAIL G C
CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE
MPXV4006 20 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.008 (0.20) C A B A E e
5 4
GAGE PLANE
e/2 .014 (0.35)
D
L DETAIL G
A1
8
1 8X
F
b 0.004 (0.1)
M
CAB
B
E1
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
DIM A A1 b D E E1 e F K L M N P T INCHES MILLIMETERS MIN MAX MIN MAX 0.300 0.330 7.11 7.62 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.717 BSC 18.21 BSC 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.245 0.255 6.22 6.47 0.120 0.130 3.05 3.30 0.061 0.071 1.55 1.80 0.270 0.290 6.86 7.36 0.080 0.090 2.03 2.28 0.009 0.011 0.23 0.28 0.115 0.125 2.92 3.17 0 7 0 7
T
N K
A 0.004 (0.1)
SEATING PLANE
M
P
8X
DETAIL G C
CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE
MPXV4006 Sensors Freescale Semiconductor 21
How to Reach Us:
Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 010 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2009. All rights reserved.
MPXV4006 Rev. 3 1/2009

▲Up To Search▲

Price & Availability of MPXV4006

	To Download MPXV4006 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .